Custom High-Performance Epoxy Potting Compound For Electronics | Waterproof & Flame Retardant Insulation Sealant
Description of Epoxy Potting Compound
Our high-performance Epoxy Potting Compound is specifically formulated for the sealing, encapsulation, and protection of delicate electronic components. Offering superior electrical insulation, exceptional mechanical strength, and outstanding resistance to moisture and chemicals, it provides the ultimate heavy-duty defense for printed circuit boards (PCBs), sensors, and automotive electronics under harsh operating conditions.
Product Features of epoxy potting compound:
Excellent Electrical Insulation,Outstanding Environmental Protection,High Mechanical Strength,Chemical & Corrosion Resistance,Low Shrinkage
Application of epoxy resin potting:
- Automotive Electronics: Ignition coils, ECUs, sensors, power converters, and EV battery management systems (BMS).
- Power & Industrial: Power supplies, transformers, LED drivers, relays, and controllers.
- Consumer Electronics: Smart home appliances, chargers, and outdoor electronic devices.
- Aerospace & Marine: Ruggedized marine electronics and aviation control modules exposed to extreme environments.
Physical Properties of epoxy potting compound:
| fore curing |
builder |
Epoxy resin 5508 |
Curing agent 5508 |
| pigment |
Black / White et al |
Ruburn / transparent surface |
| |
A sticky epoxy resin water |
r liquid specific |
| c gravity, g / cm3 |
1.4-1.5 |
1.05 |
| Viscosity of 25℃ |
4,500—6,000cp s |
150—250cp storage |
| e Period (25℃) |
Six months |
x months |
|
processabili
|
mixing ratio |
A: B =5:1 (weight ratio) |
| Available for a time of 25℃ |
2-3H (100g mix) |
| curing time |
25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H |
| After curing |
2 Tensile strength of kg/cm |
16-18 |
| 2 Compressive strength of kg/cm |
18-22 |
| Resistance to the voltage of kv/mm |
20-22 |
| Surface resistance ofΩ-cm |
14
1.2*10
|
| Volume resistance ofΩ-cm |
15
1.1*10
|
| contraction percentage% |
0.35-0.55 |
| Water absorption rate was 25℃ * 24H |
<0.03% |
How to use epoxy potting compound:
- Preparation: Ensure the substrate surface is clean, dry, and free of oil or dust.
- Mixing: Weigh Part A and Part B accurately according to the specified weight ratio. Stir thoroughly for 2-3 minutes, scraping the sides and bottom of the container.
- De-airing: Vacuum degas the mixture for 3-5 minutes to ensure a bubble-free finish.
- Curing: Pour into the housing and allow to cure at room temperature or accelerate with heat according to the TDS instructions.
Package of epoxy potting compound:
25kg/barrel
Precautions & Handling Instructions of epoxy potting compound:
1. Safety & Personal Protection
- Wear Protective Gear: Always wear appropriate personal protective equipment (PPE), including chemical-resistant gloves, safety goggles, and protective clothing during handling.
- Use in Ventilated Areas: Ensure adequate ventilation or use a local exhaust system in the working area to avoid inhaling vapors released during mixing and curing.
- Skin & Eye Contact: In case of skin contact, wipe off immediately and wash thoroughly with soap and water. If contact with eyes occurs, rinse with plenty of water for at least 15 minutes and seek medical attention immediately.
2. Storage & Shelf Life
- Keep Sealed: Store both Part A and Part B in their original, tightly sealed containers when not in use to prevent contamination and moisture absorption.
- Optimal Temperature: Store in a cool, dry, and well-ventilated warehouse at temperatures between 15°C to 25°C. Keep away from direct sunlight, heat sources, and open flames.
- Check Shelf Life: Use the product within its designated shelf life (typically 6 to 12 months from the date of manufacture). Expired products may exhibit compromised curing performance.
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Custom High-Performance Epoxy Potting Compound For Electronics | Waterproof & Flame Retardant Insulation Sealant Images
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