Low Viscosity Potting Silicone HN-8806A/B | Easy Pouring & Excellent Penetration for PCBA
Product Overview for silicone potting compound:
Ensures protection everywhere. The low viscosity of HN-8806 (2000-3000 mPa·S) allows it to easily penetrate every corner of high-density PCBAs, encapsulating fine-pitch components and micro parts, achieving complete, gap-free protection.
Key Features:Low Viscosity & Easy Flow | Excellent Penetration | Easy Vacuum Deaeration | Repairable Elastic Cure | Good Adhesion to Various Materials.
Technical Parameters for silicone potting compound:
Viscosity (A&B, @25°C): 2000-3000 mPa·S
Hardness (Shore A): 45±5
Pot Life (@25°C): 0.3-0.4 hours
Dielectric Strength: 18-25 kV/mm
Volume Resistivity: 1.0×10¹⁶ Ω·cm
Product Applications for silicone potting compound:
High-Density PCBAs:Communication motherboards, server boards, high-pin-count control boards.
Miniaturized Electronics:Wearable devices, sensor modules, boards with 01005/0201 components or BGAs.
Automotive ECUs:Circuit protection for Automotive Electronic Control Units.
Precision Circuits:Instrumentation, internal boards of data acquisition cards.
Usage Instructions for silicone potting compound:
1. StandardPreparationandMixing.
2. Potting:Use pouring, potting, or injection methods, allowing it to flow and spread naturally.
3. Deaeration:Vacuum deaeration is highly recommended to remove trapped air in tight spaces.
4. Curing:Cure at room temperature or with heat.
Important Notes for silicone potting compound:
For PCBAs with bottom-side components, tilting the board or gentle vibration aids underfill.
Packaging & Storage for silicone potting compound:
Standard Packaging: Component A 25kg/drum, Component B 25kg/drum.
Store in a cool, dry place. Shelf life: 6 months.
FAQ for silicone potting compound:
Q: Does low viscosity mean it's prone to leaking?
A: No, if the housing is properly sealed, the compound itself will not leak. Low viscosity primarily aids filling.
Q: Can it penetrate under tiny components?
A: Yes, its excellent flow allows it to encapsulate fine-pitch leads, under BGAs, and other hard-to-reach areas.
Q: How to minimize bubbles?
A: Stir in one direction, gently vibrate the assembly after potting, or use the most effective method – vacuum deaeration.
Q: Is it repairable after curing?
A: Yes, as an elastomer, it can be locally cut and peeled using specialized tools and solvents, though skill is required.
Q: Does it adhere well to different PCB materials?
A: It adheres well to most common materials. For specific low-surface-energy plastics, please consult us.
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